1.27mm 0.050" 1.26mm [0.050"] 1.26mm [0.050"] 33.00mm [1.299"] 33.00mm [1.299"] 0.66mm [0.026"] 2.37mm [0.093"] 3.03mm [0.119"] 30.48mm [1.200"] d e s c r i p t i o n : giga-snap bga smt foot 503 position (1.27mm pitch) gold plated female rece ptacle pins to smt solder balls (bga type). pin asi gnment 1:1. status: released drawing: j. glab scale: 3:1 rev: a date: 05/25/07 modified: file: SF-BGA503C-B-32F dwg SF-BGA503C-B-32F drawing ? 2007 ironwood electronics, inc. 11351 rupp dr., suite 400, burnsville, mn 55337 tel: (952) 229-8200 www.ironwoodelectronics.com 1 substrate: 1.59mm 0.18mm [0.0625" 0.007"] fr4/g10 or equivalent high temp material. (rohs) 2 top view side view pins: material- brass alloy 360 1/2 hard; finish- 0.25m [10"] au over 1.27m [50"] ni (min.). 3 contacts: beryllium copper alloy172, ht; finish- 0.25m [10"] au over 1.27m [50"] ni (min.). patent pending 4 solder balls ( sn96.5ag3.0cu0.5 ) c o n t a c t d a t a accepts 0.20mm - 0.33mm diameter pins 3-finger 37/25 gram, initial insertion force (with 0.254mm/0 .203mm dia. pin) 30/22 gram, normal force (with 0.254mm/0.203mm dia. pin) 20/17 gram, extraction force (with 0.254mm0.203mm d ia. pin) 1 4 2 3 t o l e r a n c e s : diameters 0.03mm [0.001"], pcb perimeters 0.18m m [0.007"], pcb thicknesses 0.18mm [0.007"], pit ches (from true position) 0.08mm [0.003"], all other tolerances 0.13mm [0 .005"] unless stated otherwise. materials and spec ifications are subject to change without notice. r r r r o o o o h h h h s s s s c c c c o o o o m m m m p p p p l l l l i i i i a a a a n n n n t t t t d etail a detail a 1.33mm [0.052"] 2.37mm [0.093"]
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